Dear authors and colleagues,

We greatly regret to inform you that considering the current situation of COVID-19, to provide a safe and comfortable academic exchange environment for all participants, the conference committee has decided to Change BDAI 2020 to a virtual conference, which will be held online. We are very sorry for any inconvenience caused by this cancellation. We deeply appreciated your support to BDAI


非常遗憾地通知您鉴于当前全球新冠肺炎疫情最新动态,有效减少人员聚集,给所有与会者提供安全的学术交流环境,更好地保障大家的健康安全。原计划于2020年11月 26 日至 11 月 29 日在中国深圳举行的2020年大数据与人工智能产业应用国际会议(BDAI 2020)调整为线上会议。由此带来的不便,我们深表歉意。非常感谢您对BDAI的支持!


BDAI 2020 Conference Program Overview-Full Conference Program for Download

This is a tentative program for reference only, program is subject to final confirmation.

Call for Papers-征文主题

AI 人工智能

Machine Learning 机器学习

Big Data 大数据

Data Science 数据科学

Industry 4.0 & Robotics 工业4.0 &机器人


1, All the registered and presented papers will be published in the Journal of Physics: Conference Series (ISSN: 1742-6596) , which will be submitted to Engineering Village, Scopus, Thomson Reuters (WoS) and other indexing organizations for review and indexing.

2, Selected excellent presented papers will be recommended to publish in the speci issue of AI EDAM,ISSN: 1469-1760 (Online),  which will be indexed by Science Citation Index Expanded,  EI Compendex, SCOPUS, etc.  
所有提交的文章将送审会议组委会, 会议收录的文章将出版在英国皇家物理学会(IOP publishing)旗下IPCS会议论文录中,并提交Engineering Vilage, Scopus, Thomson Reuters (WoS)等其他检索机构审核和检索。

优秀文章可推荐到 AI EDAM,ISSN: 1469-1760 (Online)特刊中出版,并提交Science Citation Index Expanded, EI Compendex, SCOPUS等检索。

* Deadline for Journal full submissions: 30th April 2021

Submission Methods-投稿方式

Authors can submit manuscripts through electronic submission system or email. In order to avoid repeated submission, please just choose one submission method. Please click following link:

Electronic Submission System

Peer Review Instructions-审核指南

All the papers will be peer reviewed by 2-3 experts. It takes 20-30 working days for the result coming out. If the paper needs revising, it should be resubmitted for peer review again.

Paper Template-文章模板

The papers should adhere to the Template! Author can choose from the templates listed as follows:

1) Abstract Template for Oral Presentation

2) Abstract Template for Poster Presentation

3) Full Paper Template (Microsoft Word)

Important Dates-重要日期

Abstract Submission Deadline: Sept. 20, 2020

Full Paper Submission Deadline: Sept. 25, 2020

Notification of Acceptance: Oct. 15, 2020

Registration Deadline: Oct. 30, 2020

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ABout us

2020 International Conference on Industrial Applications of Big Data and Artificial Intelligence (BDAI 2020) will be held in Shenzhen, China during Nov. 26-29, 2020, which is organized by Hong Kong Society of Mechanical Engineers(HKSME). We warmly welcome prospective authors to submit your research papers to BDAI 2020, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.

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Registration Document 注册文件

After received notification, authors need to download and complete the Registration Form, then, send your final papers , filled registration form and the scanned payment proof to us.
1) Registration Form (English Version)

2) 中文注册表


Programes Overeview 议程预览

Nov. 26, 2020-Registration and Conference kits collection 签到,领取会议资料

Nov. 27, 2020-Opening Remark + Plenary Lectures + Technical Sessions 开幕式+ 大会报告+ 主题研讨会

Nov.28, 2020-Invited Speech + Technical Sessions 特邀报告+ 主题研讨会

Nov.29, 2020-Techninal Tour 学术参观



BDAI 2020 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to electronic contribution system. BDAI 2020 现面向广大学者公开征集稿件(征文主题详见),欢迎广大学者踊跃投稿!

BDAI 2020 will be held in Shenzhen, China during Nov. 26-29, 2020! 2020年大数据与人工智能产业应用国际会议将于2020年11月26日-29日在中国深圳召开!

BDAI 2019 was successfully be held in Shanghai during Oct. 18-20, 2019! BDAI 2019 已成功于2019年10月18日至20日在中国上海召开。


Call for Participants

We warmly welcome prospective authors to submit their new research or technological contributions to BDAI 2020, for sharing valuable experiences with scientists and students from around the world. You can join the conference as author, presenter and listener


Conference Venue 会议地址

BDAI 2020 will be held in Shenzhen, China
BDAI 2020 将在中国深圳召开。


Joined Conference 联合会议

2020 International Workshop on Smart City and Intelligent Systems (WSCIS 2020)

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